Printable and flexible electronics, two-dimensional materials, RFID, biosensors, solar cells, health
Project funded by the European Union’s Horizon 2020 research and innovation programme, under grant agreement Nr. 825213
The WASP project aims at bringing the much-needed step change in flexible and wearable electronics by developing a new industrially driven enabling printing technology for the definition of electronic devices and circuits on paper, a flexible and foldable substrate, which is low cost, dsiposable, biodegradable, easily obtainable in nature and compatible with high speed roll-to-roll processes.
About
Partners
The WASP consortium consists of eigth partners, and it is highly interdisciplinary, combining world-class experts in the areas described in the dedicated section.
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